Self-Assembly of Cylinder-Forming Block Copolymers by Means of High-Temperature Thermal Treatments

The continuous demand for small portable electronics is pushing the semiconductor industry to develop novel lithographic methods to fabricate the elementary structures for microelectronics devices with dimensions reduced size. Self-Assembly of Block copolymers is extremely appealing due to its excellent compatibility with conventional photolithographic processes, high-resolution patterns and low process costs. This thesis work will focus on the Self-Assembly of cylinderforming Block copolymers as promising next-generation technology for the fabrication of sub-20 nm structures. Two different BCPs were investigated: polystyrene-b- polymethylmethacrylate (PSb-PMMA) and Polystyrene-block- poly(dimethylsiloxane-random-vinylmethylsiloxane) (PS-b-P(DMS-r-VMS)).